Ma, Xiaokun and Lee, Nam-Hee and Oh, Hyo-Jin and Hwang, Jong-Sun and Kim, Sun-Jae (2010) Preparation and Characterization of Silica/Polyamide-imide Nanocomposite Thin Films. Nanoscale Research Letters, 5 (11). pp. 1846-1851.
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The functional silica/polyamide-imide com-posite ﬁlms were prepared via simple ultrasonic blending, after the silica nanoparticles were modiﬁed by cationic surfactant—cetyltrimethyl ammonium bromide (CTAB). The composite ﬁlms were characterized by scanning elec-tron microscope (SEM), thermo gravimetric analysis (TGA) and thermomechanical analysis (TMA). CTAB-modiﬁed silica nanoparticles were well dispersed in the polyamide-imide matrix, and the amount of silica nano-particles to PAI was investigated to be from 2 to 10 wt%. Especially, the coefﬁcients of thermal expansion (CET) continuously decreased with the amount of silica particles increasing. The high thermal stability and low coefﬁcient of thermal expansion showed that the nanocomposite ﬁlms can be widely used in the enamel wire industry.
|Subjects:||Material Science > Nanostructured materials|
|Deposited On:||06 Jun 2011 08:05|
|Last Modified:||06 Jun 2011 08:05|
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