Nano Archive

Optimal design of coating material for nanoparticles and its application for low-temperature interconnection

Tobita, Motoi and Yasuda, Yusuke and Ide, Eiichi and Ushio, Jiro and Morita, Toshiaki (2010) Optimal design of coating material for nanoparticles and its application for low-temperature interconnection. Journal of Nanoparticle Research, 12 (6). pp. 2135-2144.

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Abstract

Metal nanoparticles need coating material so as to avoid aggregating to each other. On the contrary, there are occasions when the coating materials are required to be removed. Here, a theoretical model to relate removability of coating materials to their molecular structure is suggested. The model is used to find an optimum coating material, secondary amine, for use in low-temperature interconnection material. An interconnection made of methyloctylamine-coated silver nanoparticles was formed between a pair of copper electrodes by heating and pressurizing the nanoparticles and electrodes at 250 °C and 2.5 MPa, respectively, for 150 s. Shear strength and thermal conductivity of the formed interconnection were 17.8 MPa and 219 W/mK, respectively. This thermal conductivity value is greater than that obtained using Pb–Sn and silver solders.

Item Type:Article
Uncontrolled Keywords:Nanoparticle - Interconnection - Coating material - Silver nanoparticles - Electronic industry
Subjects:Material Science > Nanofabrication processes and tools
ID Code:9456
Deposited By:SPI
Deposited On:02 Aug 2010 16:10
Last Modified:02 Aug 2010 16:10

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