Saydur Rahman, S. M. and Cui, Bo (2010) Mold Fabrication for 3D Dual Damascene Imprinting. NANOSCALE RESEARCH LETTERS, 5 (3). pp. 545-549. ISSN 1931-7573 (Print) 1556-276X (Online)
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Previously, a damascene process based on nanoimprint lithography has been proposed (Schmid G M, et al. in J Vac Sci Technol B 24(3) 1283, 2006) to greatly reduce the fabrication steps of metal interconnection in integrated circuit. For such a process to become a viable technique, a mold having two pattern levels with precise alignment between them must be fabricated first. To this end, this work demonstrates a âself-alignedâ fabrication process where the two pattern levels would be perfectly aligned if ignoring the noise during e-beam writing. The process is based on one EBL on a bi-layer resist stack, with the sensitivity for the top layer much higher than that of the bottom layer, which enables separate pattern transfer of the two pattern levels. Using ZEP-520A and poly(dimethylglutarimide) (PMGI) resists, we fabricated pillars having a diameter of 150Â nm sitting on ridges having a width of 1.5Â Î¼m, which can be used to create via-holes and trenches for IC interconnect by nanoimprint lithography. The current process can also find applications in other areas that require two-level patterning with precise alignment between them.
|Subjects:||Material Science > Nanofabrication processes and tools|
|Deposited By:||M T V|
|Deposited On:||21 Apr 2010 15:26|
|Last Modified:||21 Apr 2010 15:26|
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