Ko, Wen-Yin and Chen, Wei-Hung and Cheng, Ching-Yuan and Lin, Kaun-Jiuh (2009) Architectural Growth of Cu Nanoparticles Through Electrodeposition. Nanoscale Research Letters, 4 (12). pp. 1481-1485. ISSN 1931-7573 (Print) 1556-276X (Online)
Official URL: http://www.springerlink.com/content/k57471443017gv...
Cu particles with different architectures such as pyramid, cube, and multipod have been successfully fabricated on the surface of Au films, which is the polycrystalline Au substrate with (111) domains, using the electrodeposition technique in the presence of the surface-capping reagents of dodecylbenzene sulfonic acid and poly(vinylpyrrolidone). Further, the growth evolution of pyramidal Cu nanoparticles was observed for the first time. We believe that our method might open new possibilities for fabricating nanomaterials of non-noble transition metals with various novel architectures, which can then potentially be utilized in applications such as biosensors, catalysis, photovoltaic cells, and electronic nanodevices.
|Subjects:||Physical Science > Nanophysics|
Physical Science > Nano objects
Material Science > Nanochemistry
Material Science > Nanostructured materials
|Divisions:||Faculty of Engineering, Science and Mathematics > School of Physics|
Faculty of Engineering, Science and Mathematics > School of Chemistry
|Deposited On:||05 Jun 2010 10:02|
|Last Modified:||05 Jun 2010 10:02|
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