Nano Archive

Composite electroplating of Cu-SiO2 nano particles on carbon fiber reinforced epoxy composites

Li, H and Wan, YZ and Liang, H and Li, XL and Huang, Y and He, F (2009) Composite electroplating of Cu-SiO2 nano particles on carbon fiber reinforced epoxy composites. APPLIED SURFACE SCIENCE, 256 (5). pp. 1614-1616. ISSN 0169-4332

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Abstract

The main purpose of this work is to co-deposit nano-SiO2 particles into the copper coatings on carbon fiber reinforced epoxy (C/EP) composite surface by electrodeposition method in order to improve the micro hardness of coatings. C/EP composites are copper plated with sulfuric acid based solution, and the effects of nano-SiO2 and C6H12O6 in the electrolyte contents on the copper coatings are investigated. It is found that crystalline grains of coatings are markedly refined by nano-SiO2 in the acidic sulfate copper plating bath and the ceramic particles cause an increase in hardness of coatings though nano-SiO2 results in a decline of deposition rate and a decrease in electrical conductivity of electroplating layers. Otherwise, C6H12O6 in the plating bath is indispensable to the layer formation even though nano-SiO2 added. These results demonstrate that the hardness of coatings will be increased with appropriate contents of co-deposited SiO2 and C6H12O6 in the plating bath

Item Type:Article
Subjects:Material Science > Nanofabrication processes and tools
ID Code:7891
Deposited By:CSMNT
Deposited On:26 Dec 2009 07:31
Last Modified:26 Dec 2009 07:31

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