Li, H and Wan, YZ and Liang, H and Li, XL and Huang, Y and He, F (2009) Composite electroplating of Cu-SiO2 nano particles on carbon fiber reinforced epoxy composites. APPLIED SURFACE SCIENCE, 256 (5). pp. 1614-1616. ISSN 0169-4332
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Abstract
The main purpose of this work is to co-deposit nano-SiO2 particles into the copper coatings on carbon fiber reinforced epoxy (C/EP) composite surface by electrodeposition method in order to improve the micro hardness of coatings. C/EP composites are copper plated with sulfuric acid based solution, and the effects of nano-SiO2 and C6H12O6 in the electrolyte contents on the copper coatings are investigated. It is found that crystalline grains of coatings are markedly refined by nano-SiO2 in the acidic sulfate copper plating bath and the ceramic particles cause an increase in hardness of coatings though nano-SiO2 results in a decline of deposition rate and a decrease in electrical conductivity of electroplating layers. Otherwise, C6H12O6 in the plating bath is indispensable to the layer formation even though nano-SiO2 added. These results demonstrate that the hardness of coatings will be increased with appropriate contents of co-deposited SiO2 and C6H12O6 in the plating bath
| Item Type: | Article |
|---|---|
| Subjects: | Material Science > Nanofabrication processes and tools |
| ID Code: | 7891 |
| Deposited By: | CSMNT |
| Deposited On: | 26 Dec 2009 07:31 |
| Last Modified: | 26 Dec 2009 07:31 |
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