Bi, K. and Jian, Cai (2009) The fabrication of composite solder by addition of copper nano powder into Sn-3.5Ag solder. 2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009) .
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Copper nano powder was incorporated into Sn-3.5Ag solder at 3wt%, by mechanically alloyed (MA) by ball milling in a planetary ball mill at room temperature. The rotation speed was kept constant at 150 rpm with different milling time, 26 hours, 78 hours and 120 hours. The milled solder was mixed with flux and reflowed at 240 degrees C for 60 seconds. XRD result confirmed the formation of Cu3Sn after 120 hours of milling time. The melting temperature of the samples decreased as a function of milling time. The wetting angle was improved by 48% for the composite solder Sn-3.5Ag-nano-3.0Cu for 120 hours ball milled, compared to the Sn3.5Ag solder. Increased of hardness was obtained as a result of incorporation of nanoparticle.
|Additional Information:||2009 International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP 2009) Beijing, China, 10-13 August 2009 Tsinghua Univ., China|
|Uncontrolled Keywords:||composite solder; addition; copper nanopowder; solder; mechanically alloying; planetary ball mill; reflowed solders; XRD; wetting angle; hardness; nanoparticle; temperature 293 K to 298 K; time 26 h; time 78 h; time 120 h; temperature 240 degC; time 60 s; SnAg-Cu|
|Subjects:||Material Science > Nanochemistry|
Material Science > Nanostructured materials
|Deposited On:||28 Nov 2009 05:06|
|Last Modified:||28 Nov 2009 05:06|
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