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Influence of processing temperature and die angle on the grain microstructure produced by severe deformation of an Al-7% Si alloy

Gutierrez-Urrutia, I. and Munoz-Morris, M. A. and Puertas, I. and Luis, C. and Morris, D. G. (2008) Influence of processing temperature and die angle on the grain microstructure produced by severe deformation of an Al-7% Si alloy. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 475 (1-2). pp. 268-278.

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Abstract

Severe plastic deformation by equal-channel angular pressing has been carried out to high strains by repeated pressing using both a high-strain die and a moderate-strain die at both room temperature and at intermediate temperature. The die used appears to play no role in determining the saturation grain and dislocation microstructure after very high strains, with similar submicron grains, high dislocation densities, and silicon particle refinement observed. A slight tendency to microstructural non-uniformity is seen with the high-strain die. Severe plastic deformation at intermediate temperature leads to a coarser grain size, lower dislocation density, and precipitation of silicon from solution. The extent of grain coarsening, dislocation recovery and precipitate growth is much greater than when annealing room-temperature deformed material, since the high dislocation density accelerates precipitate formation and growth. Material strength is well described by the respective contributions of grain boundaries, dislocations, and precipitates. (c) 2007 Elsevier B.V. All rights reserved.

Item Type:Article
Uncontrolled Keywords:equal channel angular pressing (ECAP); mechanical properties; nanostructures; annealing
Subjects:Material Science > Functional and hybrid materials
ID Code:6136
Deposited By:IoN
Deposited On:03 Sep 2009 16:42
Last Modified:03 Sep 2009 16:42

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