Sanedrin, Raymond G. and Huang, Ling and Jang, Jae-Won and Kakkassety, Joseph and Mirkin, Chad A. (2008) Polyethylene glycol as a novel resist and sacrificial material for generating positive and negative nanostructures. SMALL, 4 (7). pp. 920-924.
Full text is not hosted in this archive but may be available via the Official URL, or by requesting a copy from the corresponding author.
Official URL: http://www3.interscience.wiley.com/journal/1198803...
One material for two purposes: Poly(ethylene glycol) is used as a novel etch resist to generate both raised and recessed nanoscale solid-state structures (see image). This novel resist is inexpensive, easy to use, and affords sub-100-nm resolution.
|Uncontrolled Keywords:||dip-pen nanolithography; nanostructures; polyethylene glycol; resists; wet chemical etching|
|Subjects:||Material Science > Nanofabrication processes and tools|
Material Science > Nanostructured materials
|Deposited On:||11 Sep 2009 10:12|
|Last Modified:||11 Sep 2009 10:12|
Repository Staff Only: item control page