Sanedrin, Raymond G. and Huang, Ling and Jang, Jae-Won and Kakkassety, Joseph and Mirkin, Chad A. (2008) Polyethylene glycol as a novel resist and sacrificial material for generating positive and negative nanostructures. SMALL, 4 (7). pp. 920-924.
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Official URL: http://www3.interscience.wiley.com/journal/1198803...
Abstract
One material for two purposes: Poly(ethylene glycol) is used as a novel etch resist to generate both raised and recessed nanoscale solid-state structures (see image). This novel resist is inexpensive, easy to use, and affords sub-100-nm resolution.
| Item Type: | Article |
|---|---|
| Uncontrolled Keywords: | dip-pen nanolithography; nanostructures; polyethylene glycol; resists; wet chemical etching |
| Subjects: | Material Science > Nanofabrication processes and tools Material Science > Nanostructured materials |
| ID Code: | 6026 |
| Deposited By: | IoN |
| Deposited On: | 11 Sep 2009 10:12 |
| Last Modified: | 11 Sep 2009 10:12 |
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