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Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size

Zhang, Hanzhuo and Jiang, Zhonghao and Lian, Hanshe and Jiang, Qing (2008) Strain rate dependence of tensile ductility in an electrodeposited Cu with ultrafine grain size. MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 479 (1-2). pp. 136-141.

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Official URL: http://www.sciencedirect.com/science?_ob=ArticleUR...

Abstract

Tensile behavior of an electrodeposited Cu with ultrafine grain size of similar to 200nm was studied at different strain rates and room temperature. By increasing the strain rate the elongation to fracture increased noticeably. Analysis on the deformed and fracture surfaces suggested a shear localization process in the necking stage, which led to a different tendency of cracking. Strong strain rate dependences of work hardening and shear localization might be responsible for variation of the tensile ductility. (c) 2007 Elsevier B.V. All rights reserved.

Item Type:Article
Uncontrolled Keywords:ultrafine-grained; strain rate; ductility; work hardening; shear localization
Subjects:Material Science > Functional and hybrid materials
ID Code:5946
Deposited By:IoN
Deposited On:04 Sep 2009 11:47
Last Modified:04 Sep 2009 11:47

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