Chen, Lung-Tai and Cheng, Wood-Hi (2009) A novel plastic package for pressure sensors fabricated using the lithographic dam-ring approach. Sensors and Actuators A: Physical, 149 (1). 165 - 171.
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Official URL: http://www.sciencedirect.com/science/article/B6THG...
This study presents a novel plastic package for piezoresistive pressure sensors. A photoresist dam-ring patterned using the lithographic process is spin-coated on a piezoresistive pressure sensor to define a sensing channel in the pressure sensor package. Fluid epoxy molding encapsulates the pressure sensor and exposes the sensing channel during a high-temperature molding process at 165 °C. Experimental observations reveal that the silicon membrane of the pressure sensor is completely free of epoxy molding compound (EMC) contamination after the transfer molding process. The effectiveness of the dam-ring in shielding the silicon membrane of the pressure sensor during the molding process was confirmed. The packaged pressure sensor exerts a thermo-mechanical stress on the silicon membrane of the pressure sensor, resulting in an undesired output voltage drift. However, employing a package design with a large sensing channel opening can reduce the effect of package-induced stress. The proposed packaging scheme was a small package volume and surface-mount device (SMD) compatible features, making it suitable for portable commercial devices
|Uncontrolled Keywords:||Piezoresistive pressure sensor; Photoresist; Packaging; Transfer molding|
|Subjects:||Analytical Science > Nanotechnology for sensing and actuating|
|Deposited On:||09 Apr 2009 12:02|
|Last Modified:||09 Apr 2009 12:02|
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