Nano Archive

Investigation of Ni-based thermal bimaterial structure for sensor and actuator application

Huang, Chia-Sheng and Cheng, Yu-Ting and Chung, Junwei and Hsu, Wensyang (2009) Investigation of Ni-based thermal bimaterial structure for sensor and actuator application. Sensors and Actuators A: Physical, 149 (2). 298 - 304.

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Thermal bimaterial structures made of Ni and Ni-diamond nanocomposite for sensor and actuator application are proposed, fabricated, and tested. Two deflection types of thermal bimaterial structures, including upward and downward bending types, can be easily fabricated by controlling electroplating sequence of Ni and Ni-diamond nanocomposite. According to thermal performance measurement, the tip deflection of upward and downward types can reach about 82.5 μm and −22.5 μm for a temperature change of 200 °C, respectively. In the condition, the thermomechanical sensitivity and output force are 412.5 nm/K and 97.0 μN for upward type thermal bimaterial structure; and −112.5 nm/K and −26.5 μN for downward type one. Due to the low electroplating process temperature (50 °C) for both Ni-based layers, diminutive pre-deformation of as-fabricated structure and strong interlaminar bonding strength are verified by SEM and vibrational test. The resonant frequency of the structure remains unchanged after 109 cycles.

Item Type:Article
Uncontrolled Keywords:Bimaterial structure; Bimorph; Electroplating; Nanocomposite
Subjects:Analytical Science > Nanotechnology for sensing and actuating
Material Science > Nanostructured materials
ID Code:4952
Deposited By:SPI
Deposited On:09 Apr 2009 12:29
Last Modified:09 Apr 2009 12:29

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