Nano Archive

Silicon shadow mask fabrication for patterned metal deposition with microscale dimensions using a novel corner compensation scheme

Apanius, Matt and Kaul, Pankaj B. and Abramson, Alexis R. (2007) Silicon shadow mask fabrication for patterned metal deposition with microscale dimensions using a novel corner compensation scheme. Sensors and Actuators A: Physical, 140 (2). 168 - 175.

Full text is not hosted in this archive but may be available via the Official URL, or by requesting a copy from the corresponding author.

Official URL: http://www.sciencedirect.com/science/article/B6THG...

Abstract

Pattern deposition of metals with controlled and microscale dimensions can be a challenging task if traditional photolithography is not a practical option. This is a particularly valid concern for the case of certain polymer substrates, which are gaining in importance in the microelectronics and related industries. Therefore, a novel design and process flow for batch fabricating low cost reusable silicon shadow masks was developed. Of note was the corner compensation scheme employed to avoid over-etching of the convex corners in the design. These shadow masks enabled deposition of metals or other suitable materials with feature sizes ranging from approximately 3 to 250 μm and were successfully utilized to form patterned metal heater lines and pads on various samples. The heaters, required for conducting thermal conductivity measurements of the underlying films/substrates using the three omega (3ω) method, showed resistance–temperature linearity, confirming theoretical estimates to within 0.2%. Moreover, the room temperature thermal conductivity of an amorphous SiO2 film as well as a polyaniline thick film were measured, further validating the deposition through shadow mask technique.

Item Type:Article
Uncontrolled Keywords:Shadow mask; Stencil; Polymers; Thermal conductivity; Three omega; Metal deposition
Subjects:Analytical Science > Nanotechnology for sensing and actuating
Material Science > Nanostructured materials
ID Code:4873
Deposited By:SPI
Deposited On:24 Apr 2009 17:21
Last Modified:24 Apr 2009 17:21

Repository Staff Only: item control page