Jeffrey, C and Dumas, Norbert and Xu, Z and Mailly, F and Azaïs, F and Nouet, P and Bunyan, R. J. T. and King, D. O. and Mathias, H and Gilles, J. P. and Richardson, A. M. D. (2007) Sensor testing through bias superposition. Sensors and Actuators A: Physical, 136 (1). 441 - 455.
Full text is not hosted in this archive but may be available via the Official URL, or by requesting a copy from the corresponding author.
Official URL: http://www.sciencedirect.com/science/article/B6THG...
A novel on-line monitoring technique for integrated MEMS is presented based on injection of an electrical test stimulus into the bias structure through both superposition or modulation. The techniques “bias superposition and bias modulation” both support integrated structural test that targets both production test and on-line condition monitoring through generation of dependability metric. It can in some cases be used to provide the raw data for on-line calibration and compensation. The techniques are demonstrated on three integrated MEMS structures from the field of consumer electronics, aerospace and environmental sensing and have been successfully applied to a thick film conductance sensor.
|Additional Information:||25th Anniversary of Sensors and Actuators A: Physical|
|Uncontrolled Keywords:||Sensors; On-line monitoring; Condition monitoring; Design for Testability; Test; MEMS|
|Subjects:||Analytical Science > Nanotechnology for sensing and actuating|
|Deposited On:||27 Apr 2009 10:37|
|Last Modified:||27 Apr 2009 10:37|
Repository Staff Only: item control page