Nano Archive

Sensor testing through bias superposition

Jeffrey, C and Dumas, Norbert and Xu, Z and Mailly, F and Azaïs, F and Nouet, P and Bunyan, R. J. T. and King, D. O. and Mathias, H and Gilles, J. P. and Richardson, A. M. D. (2007) Sensor testing through bias superposition. Sensors and Actuators A: Physical, 136 (1). 441 - 455.

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Official URL: http://www.sciencedirect.com/science/article/B6THG...

Abstract

A novel on-line monitoring technique for integrated MEMS is presented based on injection of an electrical test stimulus into the bias structure through both superposition or modulation. The techniques “bias superposition and bias modulation” both support integrated structural test that targets both production test and on-line condition monitoring through generation of dependability metric. It can in some cases be used to provide the raw data for on-line calibration and compensation. The techniques are demonstrated on three integrated MEMS structures from the field of consumer electronics, aerospace and environmental sensing and have been successfully applied to a thick film conductance sensor.

Item Type:Article
Additional Information:25th Anniversary of Sensors and Actuators A: Physical
Uncontrolled Keywords:Sensors; On-line monitoring; Condition monitoring; Design for Testability; Test; MEMS
Subjects:Analytical Science > Nanotechnology for sensing and actuating
ID Code:4857
Deposited By:SPI
Deposited On:27 Apr 2009 10:37
Last Modified:27 Apr 2009 10:37

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