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Thermo-piezoelectric Si3N4 cantilever array on CMOS circuit for high density probe-based data storage

Kim, Young-Sik and Jang, Seongsoo and Lee, Caroline Sunyong and Jin, Won-Hyeog and Cho, II-Joo and Ha, Man-Hyo and Nam, Hyo-Jin and Bu, Jong-Uk and Chang, Sun-II and Yoon, Euisik (2007) Thermo-piezoelectric Si3N4 cantilever array on CMOS circuit for high density probe-based data storage. Sensors and Actuators A: Physical, 135 (1). 67 - 72.

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Official URL: http://www.sciencedirect.com/science/article/B6THG...

Abstract

A novel wafer level transfer method of silicon nitride cantilever arrays on a conventional CMOS wafer has been developed for the high density usage of probe based data storage device. The cantilevers are so called thermo-piezoelectric cantilevers consist of poly silicon heaters for writing and piezoelectric sensors for reading. The cantilevers were fabricated with a commercial p-type Si wafer instead of a SOI wafer used for this application before. The wafer level transfer method presented here, consists of only one direct bonding of the wafer with cantilevers and the one with CMOS circuits. Thirty-four by thirty-four array of cantilevers were successfully transferred with this method. With a thermo-piezoelectric silicon nitride cantilever transferred with this method, 65 nm of data bits were recorded on a PMMA film. We also obtained piezo-electric reading signals from the transferred cantilevers.

Item Type:Article
Additional Information:Special Issue of The Micromechanics section of Sensors and Actuators (SAMM, based on contributions revised from the Technical Digest of the IEEE 19th International conference on Micro Electro Mechanical Systems (MEMS 2006), 19th International Conference on Micro Electro Mechanical Systems (MEMS-2006)
Uncontrolled Keywords:Atomic force microscopy; PZT cantilever; Electrical coupling; High speed; PZT actuator; Piezoresistor; Thermo-piezoelectric cantilever; Wafer-level transfer
Subjects:Analytical Science > Nanotechnology for sensing and actuating
ID Code:4821
Deposited By:SPI
Deposited On:29 Apr 2009 12:46
Last Modified:29 Apr 2009 12:46

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