Iliescu, Ciprian and Tay, Francis E. H. and Miao, Jianmin (2007) Strategies in deep wet etching of Pyrex glass. Sensors and Actuators A: Physical, 133 (2). 395 - 400.
Full text is not hosted in this archive but may be available via the Official URL, or by requesting a copy from the corresponding author.
Official URL: http://www.sciencedirect.com/science/article/B6THG...
This paper establishes the strategies for deep wet etching of one of the most common glasses: Pyrex. There are two way for increasing the etch depth: increasing the etch rate or increasing the resistance of the mask in the etching solution. The paper analyzes the methods for increasing the glass etch rate in HF solutions: annealing, concentration, ultrasonic agitation and temperature. The generation of the defects is investigated. The main factors that affect the degradation of the mask are: type, value and gradient of the residual stress and the hydrophilicity of the surface. Cr/Au mask is used for illustration. A new method for deep wet etching of glass using Cr/Au mask and photoresist is established. The result of this method is the best thus far as reported in the literature: 85 min deep wet etching in HF 49% which is equivalent to etching of more than 500 μm deep in the Pyrex glass material.
|Additional Information:||Selected Papers from the 9th International Conference on Materials for Advanced Technologies - ICMAT 2005 SI, Selected Papers from the 9th International Conference on Materials for Advanced Technologies|
|Uncontrolled Keywords:||Wet etching of glass; Residual stress; Masking layer|
|Subjects:||Analytical Science > Nanotechnology for sensing and actuating|
|Deposited On:||08 May 2009 16:40|
|Last Modified:||08 May 2009 16:40|
Repository Staff Only: item control page