Nano Archive

Strategies in deep wet etching of Pyrex glass

Iliescu, Ciprian and Tay, Francis E. H. and Miao, Jianmin (2007) Strategies in deep wet etching of Pyrex glass. Sensors and Actuators A: Physical, 133 (2). 395 - 400.

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Official URL: http://www.sciencedirect.com/science/article/B6THG...

Abstract

This paper establishes the strategies for deep wet etching of one of the most common glasses: Pyrex. There are two way for increasing the etch depth: increasing the etch rate or increasing the resistance of the mask in the etching solution. The paper analyzes the methods for increasing the glass etch rate in HF solutions: annealing, concentration, ultrasonic agitation and temperature. The generation of the defects is investigated. The main factors that affect the degradation of the mask are: type, value and gradient of the residual stress and the hydrophilicity of the surface. Cr/Au mask is used for illustration. A new method for deep wet etching of glass using Cr/Au mask and photoresist is established. The result of this method is the best thus far as reported in the literature: 85 min deep wet etching in HF 49% which is equivalent to etching of more than 500 μm deep in the Pyrex glass material.

Item Type:Article
Additional Information:Selected Papers from the 9th International Conference on Materials for Advanced Technologies - ICMAT 2005 SI, Selected Papers from the 9th International Conference on Materials for Advanced Technologies
Uncontrolled Keywords:Wet etching of glass; Residual stress; Masking layer
Subjects:Analytical Science > Nanotechnology for sensing and actuating
ID Code:4754
Deposited By:SPI
Deposited On:08 May 2009 16:40
Last Modified:08 May 2009 16:40

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