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Epoxy/Nano-Silica Composites: Curing Kinetics, Glass Transition Temperatures, Dielectric, and Thermal–Mechanical Performances

Zheng, Yun and Chonung, Kim and Wang, Genlin and Wei, Ping and Jiang, Pingkai (2009) Epoxy/Nano-Silica Composites: Curing Kinetics, Glass Transition Temperatures, Dielectric, and Thermal–Mechanical Performances. Journal of Applied Polymer Science, 111 . pp. 917-927.

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Abstract

Nano-silica particles were employed for enhancement of epoxy vacuum pressure impregnating (V.P.I.) resin. The influences of nano-silica particles on the curing reaction, glass transition temperatures, dielectric behavior, and thermomechanical performances were investigated. The activation energy (E) for the epoxy curing reaction was calculated according to Kissinger, Ozawa, and Friedman-Reich-Lev methods. The glass transition temperatures were determined by means of differential scanning calorimetry, dynamic mechanical analysis, dc conduction, and ac dielectric loss analysis. Relationships between the glass transformation behaviors, the thermomechanical performances, and the dielectric behaviors were discussed. The influences of nano-silica particles on the mechanical properties were also discussed in terms of non-notched charpy impact strength and flexural strength. The morphologies were studied by means of SEM and TEM. The results indicated that nano-silica particles could effectively increase both the toughness and strength of epoxy resin at low loadings (no more than 3 wt %) when nano-silica particles could be well dispersed in epoxy matrix without any great aggregations.

Item Type:Article
Subjects:Material Science > Nanostructured materials
ID Code:4576
Deposited By:CSMNT
Deposited On:08 Apr 2009 04:40
Last Modified:08 Apr 2009 04:40

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