Fan, Zhiyong and Ho, Johnny C. and Jacobson, Zachery A. and Yerushalmi, Role and Alley, Robert L. and Razavi, Haleh and Javey, Ali (2008) Wafer-scale assembly of highly ordered semiconductor nanowire arrays by contact printing. NANO LETTERS, 8 (1). pp. 20-25.
|PDF - Published Version|
Official URL: http://pubs.acs.org/doi/abs/10.1021/nl071626r
Controlled and uniform assembly of ``bottom-up'' nanowire (NW) materials with high scalability presents one of the significant bottleneck challenges facing the integration of nanowires for electronic applications. Here, we demonstrate wafer-scale assembly of highly ordered, dense, and regular arrays of NWs with high uniformity and reproducibility through a simple contact printing process. The assembled NW pitch is shown to be readily modulated through the surface chemical treatment of the receiver substrate, with the highest density approaching similar to 8 Wpm, similar to 95% directional alignment, and wafer-scale uniformity. Such fine control in the assembly is attained by applying a lubricant during the contact printing process which significantly minimizes the NW-NW mechanical interactions, therefore enabling well-controlled transfer of nanowires through surface chemical binding interactions. Furthermore, we demonstrate that our printing approach enables large-scale integration of NW arrays for various device structures on both rigid silicon and flexible plastic substrates, with a controlled semiconductor channel width ranging from a single NW (similar to 10 nm) up to similar to 250 mu m, consisting of a parallel array of over 1250 NWs and delivering over 1 mA of ON current.
|Subjects:||Material Science > Nanofabrication processes and tools|
Physical Science > Nanoelectronics
Technology > Manufacturing processes for nanotechnology
Engineering > Nanotechnology applications in ICT
|Deposited By:||Farnush Anwar|
|Deposited On:||12 Dec 2008 01:09|
|Last Modified:||12 Dec 2008 01:09|
Repository Staff Only: item control page