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Understanding the impact of inductance in carbon nanotube bundles for VLSI interconnect using scalable modeling techniques

Nieuwoudt, Arthur and Massoud, Yehia (2006) Understanding the impact of inductance in carbon nanotube bundles for VLSI interconnect using scalable modeling techniques. IEEE TRANSACTIONS ON NANOTECHNOLOGY, 5 (6). pp. 758-765.

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Official URL: http://dx.doi.org/10.1109/TNANO.2006.883480

Abstract

In this paper, we develop accurate and scalable models for the magnetic inductance in bundles of single-walled carbon nanotubes, which have been proposed as a means to alleviate the increasingly critical resistance problems associated with traditional copper interconnect in very large scale integraton (VLSI) applications. The models consider the density and statistical distribution of both metallic and semiconducting nanotubes within the bundle. We evaluate the speed, accuracy, and scalability of our magnetic inductance modeling techniques and previously proposed inductance models. The inductance model with the best performance evaluates the magnetic inductance of nanotube bundles with excellent accuracy when compared to modeling each nanotube individually and provides orders of magnitude improvement in CPU time as the bundle size increases. Leveraging the magnetic inductance modeling techniques, we determine the relative impact of magnetic and kinetic inductance. Based on our results, the relative value of magnetic and kinetic inductance on single-walled carbon nanotube (SWCNT) bundles is highly dependent on the bundle geometry and the per unit length kinetic inductance.

Item Type:Article
Uncontrolled Keywords:carbon nanotube; interconnect; kinetic inductance; magnetic inductance
Subjects:Material Science > Nanostructured materials
Engineering > Nanotechnology applications in ICT
ID Code:3243
Deposited By:Anuj Seth
Deposited On:13 Jan 2009 17:10
Last Modified:20 Jan 2009 15:50

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