Chen, X. H. and Lu, L. (2007) Work hardening of ultrafine-grained copper with nanoscale twins. SCRIPTA MATERIALIA, 57 (2). pp. 133-136.
Full text is not hosted in this archive but may be available via the Official URL, or by requesting a copy from the corresponding author.
Official URL: http://www.scriptamat.org/article/S1359-6462(07)00...
Work hardening behaviors of electrodeposited ultrafine-grained Cu with nanoscale growth twins are investigated by means of uniaxial continuous tensile and loading–unloading tests. A high density of nanoscale twins leads to a significant enhancement in flow strength and work hardening rate, while the work hardening coefficient (n) does not show any obvious variation with the twin density. These effects were analyzed in terms of the post-deformation microstructures.
|Uncontrolled Keywords:||ultrafine-grained copper; nanoscale twins; work hardening rate; work hardening coefficient|
|Subjects:||Material Science > Nanochemistry|
Material Science > Nanostructured materials
|Deposited By:||Anuj Seth|
|Deposited On:||28 May 2009 14:03|
|Last Modified:||28 May 2009 14:03|
Repository Staff Only: item control page