Nano Archive

Work hardening of ultrafine-grained copper with nanoscale twins

Chen, X. H. and Lu, L. (2007) Work hardening of ultrafine-grained copper with nanoscale twins. SCRIPTA MATERIALIA, 57 (2). pp. 133-136.

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Work hardening behaviors of electrodeposited ultrafine-grained Cu with nanoscale growth twins are investigated by means of uniaxial continuous tensile and loading–unloading tests. A high density of nanoscale twins leads to a significant enhancement in flow strength and work hardening rate, while the work hardening coefficient (n) does not show any obvious variation with the twin density. These effects were analyzed in terms of the post-deformation microstructures.

Item Type:Article
Uncontrolled Keywords:ultrafine-grained copper; nanoscale twins; work hardening rate; work hardening coefficient
Subjects:Material Science > Nanochemistry
Material Science > Nanostructured materials
ID Code:2257
Deposited By:Anuj Seth
Deposited On:28 May 2009 14:03
Last Modified:28 May 2009 14:03

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