V, Butyvskaya M. (2006) Chemical-Mechanical Polishing as a Method of Activation and Restoration of a Surface of Silicon Plates in Technology of Creation Structures «Silicon on&nb. Journal of NANO and MICROSYSTEM TECHNIQUE, 7 (7). pp. 40-42.
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Official URL: http://www.microsystems.ru/
Abstract
Results of research of process of chemical-mechanical polishing (CMP) are presented to technologies of creation of structures «silicon on insulator» (SOI), to the received by means of ultrasonic and atomic-power microscopy. These researches are directed on optimization of technological processor manufacturing of structures SOI, that, hence, conducts to depreciation of structures.
| Item Type: | Article |
|---|---|
| ID Code: | 2016 |
| Deposited By: | Prof. Alexey Ivanov |
| Deposited On: | 19 Dec 2008 13:21 |
| Last Modified: | 20 Mar 2009 08:58 |
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