V, Butyvskaya M. (2006) Chemical-Mechanical Polishing as a Method of Activation and Restoration of a Surface of Silicon Plates in Technology of Creation Structures ¬ęSilicon on&nb. Journal of NANO and MICROSYSTEM TECHNIQUE, 7 (7). pp. 40-42.
Full text is not hosted in this archive but may be available via the Official URL, or by requesting a copy from the corresponding author.
Official URL: http://www.microsystems.ru/
Results of research of process of chemical-mechanical polishing (CMP) are presented to technologies of creation of structures ¬ęsilicon on insulator¬Ľ (SOI), to the received by means of ultrasonic and atomic-power microscopy. These researches are directed on optimization of technological processor manufacturing of structures SOI, that, hence, conducts to depreciation of structures.
|Deposited By:||Prof. Alexey Ivanov|
|Deposited On:||19 Dec 2008 13:21|
|Last Modified:||20 Mar 2009 08:58|
Repository Staff Only: item control page