V., Butyvskaya M. (2006) The Ultrasonic Microscopy Technique as an Applicable Tool for Monitoring the Wafer Bonding Quality when Manufacturing the Silicon-on-lnsulator (SOI) Structures. Journal of NANO and MICROSYSTEM TECHNIQUE, 8 (8). pp. 12-15.
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Official URL: http://www.microsystems.ru/
Abstract
The ultrasonic (US) system of visualization of the high sanction attractive owing to an opportunity to observe a microstructure in volume of opaque objects is described and to measure elastic, viscous and relaxational properties of small areas and inclusions. Results of the control of the connected substrates which in the further will form structure "silicon on insulator" (SOI) are presented.
| Item Type: | Article |
|---|---|
| ID Code: | 2004 |
| Deposited By: | Prof. Alexey Ivanov |
| Deposited On: | 19 Dec 2008 13:20 |
| Last Modified: | 20 Mar 2009 08:58 |
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