Liu, Boyang and Huang, Yingyan and Xu, Guoyang and Ho, Seng-Tiong (2008) Nanolithography using spin-coatable ZrO2 resist and its application to sub-10 nm direct pattern transfer on compound semiconductors. NANOTECHNOLOGY, 19 (15).
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Official URL: http://www.iop.org/EJ/abstract/0957-4484/19/15/155...
A typical method for sub-micrometer compound semiconductor dry etching utilizes polymethylmethacrylate ( PMMA) to transfer patterns to SiO2 as intermediate masks, which limits its ability to obtain etching resolutions approaching sub-10 nm. We report a new approach for direct sub-10 nm pattern transfer using sol-gel derived spin-coatable ZrO2 resist as the mask. The optimal dose of ZrO2 resist is similar to 160 mC cm(-2). The sample InP compound semiconductor etching selectivity to ZrO2 is over 13:1, with high aspect ratio of 35:1. The smallest etching feature is 9 nm. These results will be very useful for realizing various challenging nanoscale photonic and electronic devices and circuits.
|Subjects:||Material Science > Nanofabrication processes and tools|
Engineering > Nanotechnology applications in ICT
|Deposited By:||Farnush Anwar|
|Deposited On:||11 Dec 2008 20:47|
|Last Modified:||11 Dec 2008 20:47|
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