Esashi, Masayoshi (2009) Micro/nano electro mechanical systems for practical applications. Journal of Physics: Conference Series, 187 (1). 012001.
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Official URL: http://stacks.iop.org/1742-6596/187/i=1/a=012001
Silicon MEMS as electrostatically levitated rotational gyroscope, 2D optical scanner and wafer level packaged devices as integrated capacitive pressure sensor and MEMS switch are described. MEMS which use non-silicon materials as diamond, PZT, conductive polymer, CNT (carbon nano tube), LTCC with electrical feedthrough, SiC (silicon carbide) and LiNbO 3 for multi-probe data storage, multi-column electron beam lithography system, probe card for wafer-level burn-in test, mould for glass press moulding and SAW wireless passive sensor respectively are also described.
|Deposited By:||Prof. Alexey Ivanov|
|Deposited On:||01 Nov 2011 23:35|
|Last Modified:||02 Nov 2011 00:47|
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