Wu, Chun-Chang and Hsu, Steve Lien-Chung (2010) Thermo-curable epoxy systems for nanoimprint lithography. Journal of Micromechanics and Microengineering, 20 (1). 015006.
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Official URL: http://stacks.iop.org/0960-1317/20/i=1/a=015006
In this work, we have used solvent-free thermo-curable epoxy systems for low-pressure and moderate-temperature nanoimprint lithography (NIL). The curing kinetic parameters and conversion of diglycidyl ether of bisphenol A (DGEBA) resin with different ambient-cure 930 and 954 hardeners were studied by the isothermal DSC technique. They are useful for the study of epoxy resins in the imprinting application. The DGEBA/930 and DGEBA/954 epoxy resists can be imprinted to obtain high-density nano- and micro-scale patterns on a flexible indium tin oxide/poly(ethylene terephthalate) (ITO/PET) substrate. The DGEBA/930 epoxy resin is not only suitable for resist material, but also for plastic mold material. Highly dense nanometer patterns can be successfully imprinted using a UV-curable resist from the DGEBA/930 epoxy mold. Using the replicated DGEBA/930 epoxy mold instead of the expensive master can prevent brittle failure of the silicon molds in the NIL.
|Deposited By:||Prof. Alexey Ivanov|
|Deposited On:||01 Nov 2011 23:30|
|Last Modified:||02 Nov 2011 00:47|
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