Zhaohui, Chen and Qin, Zhang and Kai, Wang and Xiaobing, Luo and Sheng, Liu (2011) Reliability test and failure analysis of high power LED packages. Journal of Semiconductors, 32 (1). 014007.
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Official URL: http://stacks.iop.org/1674-4926/32/i=1/a=014007
A new type application specific light emitting diode (LED) package (ASLP) with freeform polycarbonate lens for street lighting is developed, whose manufacturing processes are compatible with a typical LED packaging process. The reliability test methods and failure criterions from different vendors are reviewed and compared. It is found that test methods and failure criterions are quite different. The rapid reliability assessment standards are urgently needed for the LED industry. 85 Â°C/85 RH with 700 mA is used to test our LED modules with three other vendors for 1000 h, showing no visible degradation in optical performance for our modules, with two other vendors showing significant degradation. Some failure analysis methods such as C-SAM, Nano X-ray CT and optical microscope are used for LED packages. Some failure mechanisms such as delaminations and cracks are detected in the LED packages after the accelerated reliability testing. The finite element simulation method is helpful for the failure analysis and design of the reliability of the LED packaging. One example is used to show one currently used module in industry is vulnerable and may not easily pass the harsh thermal cycle testing.
|Deposited By:||Prof. Alexey Ivanov|
|Deposited On:||01 Nov 2011 23:23|
|Last Modified:||02 Nov 2011 00:47|
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