Ashkinazy, E.E. and Gridin, O.M. and Ralchenko, V.G. and Solovev, V.V. and Teplova, (2010) Modelling of Process QuasiPlastic of Superficial Processing of Firm Fragile Materials of Electronic Technics. Journal of NANO and MICROSYSTEM TECHNIQUE (11).
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There is a growing interest in use of very hard crystalline materials like sapphire or diamond in microelectronics. These applications require a very good quality surface finish and minimal defects in subsurface layer. Quasi-plastic level-by-level destruction of a superficial layer of the hard materials is promising for fine processing, in our experiments. Keywords: leikosapphire, microelectronics, quasi-plastic grinding, base layers, roughness
|Additional Information:||Full text is in Russian|
|Deposited By:||Prof. Alexey Ivanov|
|Deposited On:||08 Dec 2010 23:41|
|Last Modified:||09 Dec 2010 09:29|
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