Nano Archive

Modelling of Process QuasiPlastic of Superficial Processing of Firm Fragile Materials of Electronic Technics

Ashkinazy, E.E. and Gridin, O.M. and Ralchenko, V.G. and Solovev, V.V. and Teplova, (2010) Modelling of Process QuasiPlastic of Superficial Processing of Firm Fragile Materials of Electronic Technics. Journal of NANO and MICROSYSTEM TECHNIQUE (11).

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Official URL: http:// www.microsystems.ru

Abstract

There is a growing interest in use of very hard crystalline materials like sapphire or diamond in microelectronics. These applications require a very good quality surface finish and minimal defects in subsurface layer. Quasi-plastic level-by-level destruction of a superficial layer of the hard materials is promising for fine processing, in our experiments. Keywords: leikosapphire, microelectronics, quasi-plastic grinding, base layers, roughness

Item Type:Article
Additional Information:Full text is in Russian
ID Code:10327
Deposited By:Prof. Alexey Ivanov
Deposited On:08 Dec 2010 23:41
Last Modified:09 Dec 2010 09:29

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