Luchinin, V.V. and Usikova, M.A. (2010) Preparation Techniques in the View of Microtechnics' Wares' Reverse Engineering. Journal of NANO and MICROSYSTEM TECHNIQUE (3).
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Abstract
The application of reverse engineering process in modern electronic industry assumes the development of new investigation methods of microtechnics' objects and so adaptation of innovative technological and analytical techniques of preparation in order to control prototype systems' topology.In this paper breaking preparation methods, such as mechanical dissection of microtechnics' items with the subsequent removal of cross-linking layers, are discussed as well as non-damaging investigation techniques, retainin's capacity for work for succeeding electrical testing. Keywords: IC chip, topology, preparation, etching, chip
| Item Type: | Article |
|---|---|
| Additional Information: | Full text is in Russian |
| ID Code: | 10245 |
| Deposited By: | Prof. Alexey Ivanov |
| Deposited On: | 08 Dec 2010 23:40 |
| Last Modified: | 09 Dec 2010 09:29 |
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